Sputter Deposition Tool | Kurt J. Lesker PVD 75 RF and DC

The Kurt Lesker PVD 75 Physical Vapor Deposition system allows material deposition on substrates by sputtering material from a solid source (also called "target" material). A plasma based Ar sputtering process is used to deposit material of desired thickness at ~0.5 nm/s growth rates. In addition, reactive gases such as oxygen can be added to deposit oxides form of solid source material. Available target materials are: Al, SiO2, Niobium, SiN, ZnO, Cu, Zn, Ti. In addition, substrate can be heated to control deposited film properties.