Dicing Saw | Disco Model DAD 323

The Disco DAD323 dicing saw can be used to cut a variety of materials such as silicon, glass, sapphire, etc. The substrate size is limited to 150 mm diameter and height to less than 5 mm. The rotating high speed blade makes a precise cut through the substrate which is mounted on adhesive tape. Samples should be able to withstand a high flow of water (water is used to keep the blade from getting hot). The instrument can run in manual mode or automatic mode to make repetitive cuts at precise spacing.