Nordson March Reactive Ion Etch (RIE) Plasma System 2
March CS-1701 reactive ion etcher is a bench-top system with water cooled RF platen. It is capable of etching photoresist, polymer and graphene. This system could be operated under manual mode or auto mode. Comparison of the RIE systems available in the MRL shared research facilities: Substrates (e.g., Si, Glass, etc.), 2D Transition-metal dichalcogenides, dielectrics (metal oxides, nitrides, etc.) (*) Discuss with staff before actually using any of those materials and if other materials are needed in the process. This is required for new and existing experienced users. (**) Etching rate and quality will depend on several factors (type of material, sample thickness, pattern details, masking parameters, etc.). A discussion with staff is important in order to decide tool assignment and feasibility. Manufacturer's website: http://www.nordson.com/en/divisions/march/products/plasma-treatment-systems/rie-system
Capabilities
- ✓400W, 13.56 MHz RF Generator with Automatic Matching Network
- ✓Delivers Excellent Process Repeatability.
- ✓Two MFC gas flow channels: O2 and CF4.
- ✓The March RIE 1/2 chamber is configured with a 7”/5” powered electrode to accommodate a wide range of wafer sizes.
- ✓You must be qualified by staff to use this tool.
- ✓When you are done with your work, always leave the chamber under vacuum. And never leave a dirty chamber for the next user.
- ✓Location 342 MRL
- ✓Related Research Techniques Dry Etching
- ✓Related Research Cores Micro/Nano Fabrication and Cleanroom
Specifications
| Focus catcher for scrollable table RIE system | Max. RF power (W) |
| Samco RIE-10NR | 300 |
| March CS-1701 RIE | 400 |
| Plasma-therm 790 MF | 300 |
| Nano-master NPC 3000 | 400 |
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