SAMCO RIE-10NR Reactive Ion Etch System

The SAMCO RIE-10NR is a cutting-edge, fully automated Reactive Ion Etching (RIE) system specifically designed to meet the rigorous process demands of fluorine chemistry for research and production purposes. With precision, it executes etching operations, ensuring minimal sidewall deterioration and exceptional selectivity between various materials. Its capabilities extend to processing wafers up to 8 inches in diameter, showcasing its versatility in handling diverse requirements. Applications:  Highly controllable anisotropic etching of a variety of materials, including semiconductors (e.g., crystalline, polycrystalline oxides, 2D Transition-metal dichalcogenides, etc.), dielectrics (e.g., oxides, nitrides, etc.) and metals (e.g., Poly-Si, conducting oxides, Au, TiN, including refractory metals, Mo, W, etc.) as well as carbon-based materials (e.g., graphene, MXenes, etc.). Comparison of RIE tools available in the MRL shared research facilities: Substrates (e.g., Si, Glass, etc.), 2D Transition-metal dichalcogenides, dielectrics (metal oxides, nitrides, etc.) (*) Discuss with staff before actually using any of those materials and if other materials are needed in the process. This is required for new and existing experienced users. (**) Etching rate and quality will depend on several factors (type of material, sample thickness, pattern details, masking parameters, etc.). A discussion with staff is important in order to decide tool assignment and feasibility.