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STS Vision 320 Mark II RIE System
STS Vision 320 Mark II (2025)
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The STS Vision 320 Reactive Ion Etch system is configured to etch silicon dioxide, silicon nitride, and amorphous silicon. Available gases are hydrogen, methane, sulphur hexafluoride, trifluoromethane, oxygen, argon, and nitrogen.
Capabilities
- ✓Reactive ion etching
- ✓Silicon dioxide etching
- ✓Silicon nitride etching
- ✓Amorphous silicon etching
- ✓Multiple gas options
- ✓Precise pattern transfer
- ✓Anisotropic etching
Specifications
| model | Vision 320 Mark II |
| materials | SiO2, Si3N4, a-Si |
| gases | H2, CH4, SF6, CHF3, O2, Ar, N2 |
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