High-precision wafer dicing system for cutting hard materials including silicon wafers. Supports workpieces up to 200mm x 200mm with exceptional accuracy. Features 0.2 μm indexing resolution with 1.5 μm accuracy and cut depth resolution of 0.2 μm with 2.0 μm accuracy for precise component separation.

Capabilities

✓Precision wafer dicing
✓Hard material cutting
✓Silicon wafer processing
✓High-accuracy positioning
✓Large workpiece capability
✓Micrometer-level precision
✓Component separation
✓Research prototyping

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Specifications

model	7122
workpiece size	Up to 200mm x 200mm
indexing resolution	0.2 μm
indexing accuracy	1.5 μm
cut depth resolution	0.2 μm
cut depth accuracy	2.0 μm