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Focused ion beam scanning electron microscope (FIB-SEM)
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Focused Ion Beam Scanning Electron Microscopy (FIB-SEM) is an advanced imaging and analysis technique used extensively in materials science and biological research. It combines the capabilities of a FIB and a SEM to provide high-resolution 3D imaging and precise material characterization. The FIB allows for site-specific material removal/deposition for cross sectioning, preparing TEM or atom probe samples, nano-prototyping, and circuit editing. The SEM component offers high-resolution imaging of the sample's surface, creating a powerful tool for analyzing microstructures and nanostructures with exceptional precision.
Capabilities
- âś“Site specific preparation of cross sections for high-resolution SEM and TEM analysis
- âś“Multi-ion species (argon, nitrogen, oxygen, and xenon) dual beam FIB/SEM
- âś“Higher current capabilities, compared to a gallium tool, allowing for rapid milling through a wide array of materials
- âś“Large-area cross-sectioning/bulk material removal
- âś“Serial FIB milling with slice and view for 3D reconstructions, ability to collect EDS data with slice and view
- âś“Oxygen ion milling for artifact-free cuts through biological tissue and other organics
- âś“EBSD and EDS detectors
- âś“EasyliftTM micromanipulator for in-situ sample manipulation
- âś“iFastTM software for writing custom automation scripts
- âś“STEM, Thru-lens immersion, Everhart-Thornley, CDEM, and CBS detectors
- âś“Drift-corrected frame integration imaging
- âś“Field emission electron and ion beam sources, allowing high-resolution SEM imaging and excellent ion beam density
- âś“EasyliftTM micromanipulator for in-situ sample manipulation
- âś“Quorum cryo transfer system for beam sensitive materials such as polymers or biological specimens
- ✓Gas injection systems to assist with electron/ion beam metal deposition, and ion milling applications (Pt, insulator enhanced etch (XeF2), selective carbon mill, and carbon)
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