Advanced probe station for measuring and modifying prototype integrated circuits. Features EZLaze3 laser cutter with dual wavelengths: 532 nm for cutting metal traces and 355 nm for removing passivation. Equipped with high-precision M Plan Apo NUV objectives at 50X and 100X magnification for detailed inspection and modification work.

Capabilities

✓Prototype IC measurement
✓Metal trace cutting
✓Passivation removal
✓High-precision probing
✓Laser modification
✓50X/100X magnification
✓Dual wavelength lasers
✓Circuit debugging

Request Time on This Instrument Contact Facility

Specifications

model	Summit 11000
laser	EZLaze3 dual wavelength
wavelengths	532 nm (metal cutting), 355 nm (passivation)
objectives	M Plan Apo NUV 50X, 100X
application	IC measurement and modification