Ultra-precise flip chip bonding and die attach system with 5 μm placement accuracy. Handles components ranging from 0.125mm x 0.125mm to 100mm x 100mm with a working area up to 450mm x 234mm. Supports wafer and substrate sizes up to 200mm for advanced microelectronics assembly applications.

Capabilities

✓Flip chip bonding
✓Die attach processing
✓5 μm placement accuracy
✓Wide component size range
✓Large working area
✓200mm wafer support
✓Microelectronics assembly
✓High-precision positioning

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Specifications

model	FINEPLACER pico ma
placement accuracy	5 μm
component size range	0.125mm x 0.125mm to 100mm x 100mm
working area	Up to 450mm x 234mm
max wafer size	200mm
application	Flip chip and die attach