The Trion Deep Reactive Ion and Ion Beam Etcher provides vacuum-based dry etch capability compatible with several substrates (plastic, glass, metal foil). Features R2R DRIE/IBM system for 6 inch wide films, anisotropic etch capability with less than ±4% etch uniformity, 8000 W Extreme source 13.56MHz RF generator, 8 gases (CF₄, O₂, SF₆, He, Ar, CHF₃, 2 blank slots), ion beam milling chamber with 2 linear gridless sources.

Capabilities

✓Roll-to-roll dry etching
✓Deep reactive ion etching (DRIE)
✓Ion beam milling (IBM)
✓6 inch film processing
✓Anisotropic etching
✓Multiple substrate compatibility
✓High uniformity etching
✓Multiple gas chemistry

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Specifications

web width	6 inches
uniformity	±4% etch uniformity (DRIE), ±2.5% (IBM)
rf power	8000 W @ 13.56MHz
gases	CF₄, O₂, SF₆, He, Ar, CHF₃ + 2 blank
sources	2 linear gridless ion beam sources