Q800 Dynamic Mechanical Analysis (DMA)
Available

Q800 Dynamic Mechanical Analysis (DMA)

Request Quote
Commercial Rate

Dynamic Mechanical Analysis (DMA) measures mechanical properties of samples. Its principal uses include measurement of a material's Young's modulus or viscoelastic properties as a function of temperature (or time). Testing can be performed in either tensile or cantilever bending geometries. Sample sizes for the film tension clamp are 5-30 mm long, up to 6.5 mm wide, and up to 2 mm thick, with best results from an optimal sample size of approximately 20-25 mm long, depending on sample compliance (stretchier samples may be shorter), and 3 mm wide. The Q800 also includes Advantage software for complete automatic experimental control and Universal Analysis software for comprehensive data analysis.

Capabilities

  • âś“Location 133 MRL
  • âś“Related Research Techniques Center for Excellence in Soft Materials
  • âś“Related Research Cores Thermal Analysis and Soft Materials Characterization

Similar Instruments

Savannah S100 Atomic Layer Deposition Cambridge Nanotech
available
$75.00/hr
University of Illinois Urbana-Champaign
0.0(0)
Physical Electronics Trift III
available
Specialized Equipment

Physical Electronics Trift III

•

$75.00/hr
University of Illinois Urbana-Champaign
0.0(0)
Ball Bonder (25 um Gold wire, K&S 4524A)
available
Specialized Equipment

Ball Bonder (25 um Gold wire, K&S 4524A)

•

$75.00/hr
University of Illinois Urbana-Champaign
0.0(0)
Yield Engineering HMDS Vapor Prime Oven-Cleanroom
available
$75.00/hr
University of Illinois Urbana-Champaign
0.0(0)