The web-based pick and place/die attach tool provides users with an advanced capability to develop methods for flexible-hybrid electronic circuit integration and system prototyping. Modified version of standard EVO 2200-Plus with X/Y placement accuracy: ± 7 μm @ 3s, Theta placement accuracy: ± 0.15° @ 3s, die attach up to 7,000 UPH/module, and flip chip capability.

Capabilities

✓Pick and place operations
✓Die attach processing
✓Flexible-hybrid electronics
✓System prototyping
✓Flip chip bonding
✓High precision placement
✓High throughput processing

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Specifications

model	2200 Evo Plus (modified)
xy accuracy	± 7 μm @ 3s
theta accuracy	± 0.15° @ 3s
throughput	Up to 7,000 UPH/module
capability	Die attach, flip chip