Available
Request Quote
Commercial Rate
The PM6 Precision Lapping & Polishing system achieves results akin to those from large-scale production equipment. It also includes wafer bonding capabilities. It offers exceptional flexibility, handling various materials, including silicon, GaAs, rock, and soils. The system reliably produces specimens with superior quality and surface finish. Its precise plate setup features and intuitive control system ensure consistent, accurate results with minimal effort. Currently, tour tool supports the following materials: For other compatible materials with a hardness between 3 and 7 on the Mohs scale, users should contact the MRL staff before requesting training.
Capabilities
- ✓Single Workstation: This unit accommodates wafers up to 4”/100mm. Driven jig roller arms enhance accuracy and repeatability.
- ✓Recipe Mode: Allows operators to create, save, and recall multi-stage process recipes for consistent results.
- ✓Automatic Drip Detector: Stops plate rotation when abrasive cylinders are empty to prevent damage to specimens from running on a dry plate.
- ✓Real-Time Data Collection: Bluetooth-enabled for real-time data transmission and USB port export for external analysis.
- ✓Automatic Plate Flatness Control: Bluetooth technology ensures continuous in-situ measurement of plate flatness.
- ✓Silicon (Si) wafers
- ✓Silicon dioxide (SiO₂)
- ✓Strontium titanate (STO)
- ✓Lithium niobate
- ✓Location B70 MRL
- ✓Related Research Techniques Additional Micro/Nanofabrication Resources
- ✓Related Research Cores Micro/Nano Fabrication and Cleanroom
Similar Instruments
Available
Commercial Rate
Request Quote →
Available
Commercial Rate
Request Quote →
Available
Commercial Rate
Request Quote →
Available
Commercial Rate
Request Quote →