FEI Helios 600i Dual Beam SEM/FIB

Capabilities

• ✓Schottky Field Emission Cathode and Elstar ultra-high resolution (UHR) electron column with magnetic immersion and field free dual mode
• ✓Sub-nanometer SEM resolution at higher beam energies and 1.4 nm@1 kV
• ✓Standard E-T SE detector and in-lens SE and BSE with high-angle collection
• ✓A highly sensitive, retractable solid-state directional backscattered detector (DBS) for high angle back scattered electron imaging.
• ✓STEM detector for both bright and dark-field transmitted electron imaging (0.8 nm at 30 kV).
• ✓Beam deceleration mode for low landing energies and imaging with sample bias up to 4 kV.
• ✓High-resolution (field emission) ion optics (Tomahawk™ column), featuring a two-stage differential pumping and time of flight correction enabling fine high-accuracy FIB milling, deposition and etching.  Beam currents up to 65 nA for rapid milling.  Resolution down to 4.0 nm at 1.1 pA @ 30 kV.  Operation down to 500 V for near damage free cleaning.
• ✓High performance Ion Conversion and Electron (ICE) detector for secondary ions (SI) and electrons (SE)
• ✓FIB charge neutralizer (low energy electron flood source) for milling non-conductors
• ✓Platinum deposition Gas Injection Systems for EBID and IBID
• ✓OmniProbe AutoProbe™ 200 in-situ nano-manipulator and sample lift-out system with 10 nm positioning resolution allows the preparation of site specific samples.
• ✓High-precision specimen piezo goniometer stage with 150 mm travel along the x and y axes.
• ✓IR camera for viewing sample/column, Optical color Nav-Cam for sample navigation.
• ✓A high-resolution, 16-bit digital patterning engine capable of Simultaneous Pattern and Imaging (iSPI™)
• ✓AutoTEM software for automated milling of TEM lamellae.