The Hysitron TI 950 is an automated and high throughput nanomechanical characterization instrument. The patented capacitive transducer technology provides superior measurement sensitivity, accuracy, and reliability during the nanoindentation process. It has a large open sample stage to work with a variety of sample types and sizes from 12 inch wafers to samples embedded in epoxy and polished. Sample mounting options include magnetic attachment, superglue (very thin layers only), clamps with screws, and a vacuum stage to hold samples that have smooth, solid bottom surfaces. The nanoDMA III provides a quantitative and continuous measurement of mechanical properties—including hardness, storage modulus, loss modulus, complex modulus, and tan delta—as a function of indentation depth, frequency, and time.
Capabilities
- ✓Vertical travel 50 mm
- ✓Indentation depth > 5 µm
- ✓Thermal drift 0.05 nm/s
- ✓Maximum load 10 mN
- ✓Maximum load 2 mN
- ✓Maximum lateral force 5 N
- ✓Maximum scratch length 25 mm
- ✓Maximum normal force 2.8 N
- ✓Maximum normal displacement 80 µm
- ✓Optical objective 20X + digital zoom
- ✓Maximum field of view 772 x 588 µm
- ✓XY x Z travel 250 mm x 50 mm
- ✓Qualitative surface analysis before and after testing
- ✓Quantitative material properties including hardness and modulus
- ✓Ramping/reciprocating force scratch for quantification of film delamination and friction
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