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SB6 Gen2 SUSS MicroTec Wafer Bonder
SUSS MicroTec SB6 Gen2 (2025)
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With the SB6 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration and 3D integration. The SB6/8 Gen2 permits an easy switch from R&D to pilot production and finally volume manufacturing.
Capabilities
- ✓Semi-automated wafer bonding
- ✓Up to 200mm wafer handling
- ✓Multiple substrate shapes and types
- ✓MEMS applications
- ✓LED packaging
- ✓Advanced packaging
- ✓2.5D integration
- ✓3D integration
- ✓R&D to volume manufacturing
- ✓Flexible process environments
Specifications
| model | SB6 Gen2 |
| wafer size | Up to 200mm |
| automation | Semi-automated |
| applications | MEMS, LED, packaging, 2.5D/3D integration |