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EVG 520 (6 inch)
EVG 520 (6 inch) (2025)
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Semi-automated Hot Embossing System for embossing/bonding Supports up to 6 in wafers Maximum Temperature: 350 °C Maximum Contact Force: 20KN

EVG 520 (6 inch) (2025)
Semi-automated Hot Embossing System for embossing/bonding Supports up to 6 in wafers Maximum Temperature: 350 °C Maximum Contact Force: 20KN