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LPKF MiniContac RS Via Plating System
LPKF MiniContac RS (2025)
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Specialized system for plating via holes in prototype printed circuit boards. Designed for research and small-scale production with capability to handle boards up to 9" x 12" in size. Features minimum via size capability of 0.4mm for creating reliable electrical connections between PCB layers.
Capabilities
- ✓Via hole plating
- ✓PCB layer connection
- ✓Prototype processing
- ✓9" x 12" board capability
- ✓0.4mm minimum via size
- ✓Research applications
- ✓Small-scale production
- ✓Electrical connectivity
Specifications
| model | MiniContac RS |
| max board size | 9" x 12" |
| min via size | 0.4mm |
| application | Via plating for prototype PCBs |