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LPKF MultiPress S PCB Laminating System
LPKF MultiPress S (2025)
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Multi-layer PCB laminating system for bonding multiple printed circuit board layers together. Features 9" x 12" laminating area with capability to process up to 8 layers simultaneously. Essential for creating complex multilayer PCB prototypes with proper layer adhesion and electrical isolation.
Capabilities
- ✓Multi-layer lamination
- ✓Up to 8 PCB layers
- ✓9" x 12" processing area
- ✓Layer bonding
- ✓Prototype manufacturing
- ✓Electrical isolation
- ✓Complex PCB assembly
- ✓Research applications
Specifications
| model | MultiPress S |
| laminating area | 9" x 12" |
| max layers | Up to 8 layers |
| application | Multi-layer PCB lamination |