Available
Dicing Saw
Disco 3221 (2025)
Request Quote
Commercial Rate
Service work only; Internal self-use at the discretion of the Lab Manager. Requires completion of sample application. Precision dicing saw for wafer and substrate cutting with high accuracy and minimal damage.
Capabilities
- ✓Precision dicing
- ✓Wafer cutting
- ✓Substrate cutting
- ✓High precision cuts
- ✓Service work only
- ✓Lab manager approval
- ✓Sample application required
- ✓Professional operation
Specifications
| manufacturer | Disco |
| model | 3221 |
| operation | Service work only |
| approval | Lab Manager discretion |