etching
STS Vision 320 Mark II RIE System
By STS - Vision 320 Mark II (2025)
University of Massachusetts Amherst
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The STS Vision 320 Reactive Ion Etch system is configured to etch silicon dioxide, silicon nitride, and amorphous silicon. Available gases are hydrogen, methane, sulphur hexafluoride, trifluoromethane, oxygen, argon, and nitrogen.
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